Inventor

LAI CHIEH-LUNG

TW19 patents

⚠️ This page may combine multiple inventors who share the name “LAI CHIEH-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAI CHIEH-LUNG

SILICONWARE PRECISION INDUSTRIES CO LTD

Substrate structure with first and second conductive bumps having different widths

Package structure and method for fabricating the same

Electronic package and method for manufacturing the same

Method for manufacturing electronic package

Method for fabricating electronic package

Electronic package and method for fabricating the same

Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package

Electronic package and semiconductor substrate

Method of fabricating packaging structure

IND TECH RES INST

Reflective illumination device

Light source device

Lamp fixture

Fine tilting adjustment mechanism for grinding machine

TAIWAN SEMICONDUCTOR MFG CO LTD

Redistribution structure with warpage tuning layer

Semiconductor device including stress control layer and methods of forming the same

LIN HSIU-JEN

Die-bonding method of LED chip and LED manufactured by the same

LAI CHIEH-LUNG

LED package structure and fabrication method thereof

LIN JIAN-SHIAN

LED module and packaging method thereof

LIN HSIU JEN

Die-bonded LED