Inventor

SCHWARZENBACH WALTER

FR53 patents

⚠️ This page may combine multiple inventors who share the name “SCHWARZENBACH WALTER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHWARZENBACH WALTER

SOITEC SILICON ON INSULATOR

Process for detaching layers of material

Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers

Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers

Methods for minimizing defects when transferring a semiconductor useful layer

Bonding interface quality by cold cleaning and hot bonding

Method for fabricating a strained semiconductor-on-insulator substrate

Method of making cavities in a semiconductor wafer

Front-side type image sensors

Front-side type image sensor and method for manufacturing such a sensor

Substrate for a front-side-type image sensor and method for producing such a substrate

Process for detaching layers of material

Method of characterizing implantation of a species in a substrate by surface imaging

Front-side type image sensors

Semiconductor on insulator structure for a front side type imager

Method for producing an advanced substrate for hybrid integration

Method for producing an advanced substrate for hybrid integration

Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager

Method of bonding two substrates

Method for fabricating a compound-material wafer

Method for fabricating a strained semiconductor-on-insulator substrate

Method for manufacturing a CFET device

Substrate for a front-side-type image sensor and method for producing such a substrate

Method for fabricating a strained semiconductor-on-insulator substrate

Substrate for front side type imager and method of manufacturing such a substrate

Method for fabricating a strained semiconductor-on-insulator substrate

Semiconductor structure for digital and radiofrequency applications, and method for manufacturing such a structure

Method for routing a chamfered substrate

Method for bonding two substrates

Device architectures with tensile and compressive strained substrates

Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

Method of detaching a layer from a wafer using a localized starting area

Quality of a thin layer through high-temperature thermal annealing

Method for manufacturing a substrate for a front-facing image sensor

Annealing process and device of semiconductor wafer

Method for heat treating a semiconductor wafer

Annealing process and device of semiconductor wafer

Process for treating a semiconductor-on-insulator structure for improving thickness uniformity of the semiconductor layer

Method for transferring a layer from a donor substrate onto a handle substrate

Method for high-temperature annealing a multilayer wafer

Apparatus and method for splitting substrates

Apparatus and method for splitting substrates

Front-side-type image sensor

SCHWARZENBACH WALTER

Method for finishing a substrate of the semiconductor-on-insulator type

Finishing method for a silicon on insulator substrate

Defectivity of post thin layer separation by modification of its separation annealing

TETRA PAK SUISSE SA

Method and device for treating surfaces using a glow discharge plasma

S O I TECH SILICON ON INSULATO

Process for cleaving a wafer layer from a donor wafer

KERDILES SEBASTIEN

Method for transferring a layer from a donor substrate onto a handle substrate

ALAMI-IDRISSI AZIZ

Method for reclaiming a surface of a substrate

SOULIER-BOUCHET BRIGITTE

Method of producing a structure by layer transfer