Inventor
LIN WEI-CHU
TW9 patents
⚠️ This page may combine multiple inventors who share the name “LIN WEI-CHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS11516596B2Nov 29, 2022
MEMS device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11772960B2Oct 3, 2023
Method of forming dielectric and metal sealing layers on capping structure of a MEMs device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10961114B2Mar 30, 2021
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11851318B2Dec 26, 2023
MEMS device and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12202724B2Jan 21, 2025
Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12074110B2Aug 27, 2024
Method for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11462478B2Oct 4, 2022
Layer for buffer semiconductor device including microelectromechnical system (MEMS) device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60