Inventor
DHANE KEDAR
US5 patents
Patents
5 patentsUS10290561B2May 14, 2019
Thermal interfaces for integrated circuit packages
INTEL CORP2 citations71
US9799610B2Oct 24, 2017
Plurality of stiffeners with thickness variation
INTEL CORP3 citations68
US10461003B2Oct 29, 2019
Electronic package that includes multiple supports
INTEL CORP1 citations59
US11581240B2Feb 14, 2023
Liquid thermal interface material in electronic packaging
INTEL CORP0 citations58
US10157860B2Dec 18, 2018
Component stiffener architectures for microelectronic package structures
INTEL CORP1 citations51