Inventor

MANI DIVYA

US4 patents

Patents

4 patents

US11112841B2Sep 7, 2021

5G mmWave cooling through PCB

INTEL CORP3 citations69

US11640929B2May 2, 2023

Thermal management solutions for cored substrates

INTEL CORP2 citations68

US11581240B2Feb 14, 2023

Liquid thermal interface material in electronic packaging

INTEL CORP0 citations58

US11830783B2Nov 28, 2023

Embedded substrate heat sink for bottom side cooling

INTEL CORP0 citations48