Inventor
HSUEH WANG-JUNG
TW12 patents
Patents
12 patentsUS11189525B2Nov 30, 2021
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11322394B2May 3, 2022
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12593670B2Mar 31, 2026
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211787B2Jan 28, 2025
Interconnect structures and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125743B2Oct 22, 2024
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915971B2Feb 27, 2024
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670544B2Jun 6, 2023
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11640936B2May 2, 2023
Interconnect structures and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127684B2Sep 21, 2021
Low-resistance interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12363947B2Jul 15, 2025
Structure and formation method of semiconductor device with contact structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12199034B2Jan 14, 2025
Via rail structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10636697B2Apr 28, 2020
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41