Inventor

PARTHASARATHI ARVIND

US34 patents

⚠️ This page may combine multiple inventors who share the name “PARTHASARATHI ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARTHASARATHI ARVIND

OLIN CORP

Electronic package with improved thermal properties

Components for housing an integrated circuit device

Lead frames with improved adhesion to a polymer

Lead frames having a chromium and zinc alloy coating

Multi-metal layer interconnect tape for tape automated bonding

Whisker resistant tin coatings and baths and methods for making such coatings

Process for producing electroplated and/or treated metal foil

Anodized aluminum substrate having increased breakdown voltage

Leadframe having exposed, solderable outer lead ends

Method for the assembly of an electronic package

Enhanced wire-bondable leadframe

Anodized aluminum substrate having increased breakdown voltage

Multi-layer diffusion barrier for a tin coated electrical connector

Tin coatings incorporating selected elemental additions to reduce discoloration

Apparatus and process for the continuous plating of wide delicate metal foil

Copper stainproofing technique

Dendritic treatment of metallic surfaces for improving adhesive bonding

Systems for producing electroplated and/or treated metal foil

Aqueous zinc solution resistant to precipitation

Process for the manufacture of an interconnect circuit

Process for the manufacture of a three layer tape for tape automated bonding

In-situ dendritic treatment of electrodeposited foil

Preparation for improving the adhesion properties of metal foils

Electrochemical surface preparation for improving the adhesive properties of metallic surfaces

Superficial coating layer having acicular structures for electrical conductors

Laser alignment system

GUIDEWIRE SOFTWARE INC

Cyber risk analysis and remediation using network monitored sensors and methods of use

Cyber risk analysis and remediation using network monitored sensors and methods of use

Cyber risk analysis and remediation using network monitored sensors and methods of use

Diversity analysis with actionable feedback methodologies

ADVANCED TECHNOLOGY INTERCONNE

Semiconductor package with molded plastic body

Aluminum alloys for electronic components

CYGNVS INC

Cloud-based multi-tenancy computing systems and methods for providing response control and analytics

Systems for securely tracking incident data and automatically generating data incident reports using collaboration rooms with dynamic tenancy