Inventor
ISOBE NORIYUKI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “ISOBE NORIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UBE INDUSTRIES
6 patentsUS6538099B2Mar 25, 2003
Nylon 12 composition
UBE INDUSTRIES21 citations91
US5789529AAug 4, 1998
Polyamide resin composition and tubular molding comprising the same
UBE INDUSTRIES34 citations87
US4808659AFeb 28, 1989
Adhesive composition comprising organometallic polymer
UBE INDUSTRIES19 citations80
US6294644B1Sep 25, 2001
Nylon 12, nylon composition, method for producing nylon 12, and tubular molded product using nylon 12
UBE INDUSTRIES8 citations72
US4929507AMay 29, 1990
Heat-resistant paint comprising polymetallocarbosilane
UBE INDUSTRIES18 citations72
US6541085B2Apr 1, 2003
Tubular molded product using nylon 12
UBE INDUSTRIES3 citations61
HITACHI INT ELECTRIC INC
3 patentsUS10297440B2May 21, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC345 citations98
US9708708B2Jul 18, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC465 citations98
US11001923B2May 11, 2021
Method of manufacturing semiconductor device and recording medium
HITACHI INT ELECTRIC INC0 citations51
TOYO TIRE & RUBBER CO
3 patentsUS5195357AMar 23, 1993
Method for measuring resistance to slippage
TOYO TIRE & RUBBER CO25 citations91
US4908401AMar 13, 1990
Rubber composition for tire tread
TOYO TIRE & RUBBER CO27 citations91
US4946887AAug 7, 1990
Tire tread rubber composition and tire for passenger car
TOYO TIRE & RUBBER CO19 citations78
KOKUSAI ELECTRIC CORP
3 patentsUS11201054B2Dec 14, 2021
Method of manufacturing semiconductor device having higher exhaust pipe temperature and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP2 citations73
US10876207B2Dec 29, 2020
Substrate processing apparatus, liquid precursor replenishment system, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations72
US11299804B2Apr 12, 2022
Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations52