Inventor
BROOKS J MIKE
US18 patents
⚠️ This page may combine multiple inventors who share the name “BROOKS J MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
17 patentsUS6066514AMay 23, 2000
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC113 citations99
US5824569AOct 20, 1998
Semiconductor device having ball-bonded pads
MICRON TECHNOLOGY INC123 citations99
US6043564AMar 28, 2000
Semiconductor device having ball-bonded pads
MICRON TECHNOLOGY INC67 citations96
US7312101B2Dec 25, 2007
Packaged microelectronic devices and methods for packaging microelectronic devices
MICRON TECHNOLOGY INC12 citations92
US5583372ADec 10, 1996
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC37 citations92
US5760468AJun 2, 1998
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC15 citations82
US6740545B2May 25, 2004
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC4 citations74
US6489186B2Dec 3, 2002
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC4 citations74
US6362532B1Mar 26, 2002
Semiconductor device having ball-bonded pads
MICRON TECHNOLOGY INC4 citations74
US6316292B1Nov 13, 2001
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC7 citations74
US6420214B1Jul 16, 2002
Method of forming an integrated circuit device having cyanate ester buffer coat
MICRON TECHNOLOGY INC10 citations73
US5903046AMay 11, 1999
Integrated circuit device having cyanate ester buffer coat
MICRON TECHNOLOGY INC5 citations73
US6699734B2Mar 2, 2004
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC2 citations63
US6600215B1Jul 29, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC1 citations63
US6559519B2May 6, 2003
Integrated circuit device having cyanate ester buffer coat and method of fabricating same
MICRON TECHNOLOGY INC1 citations62
US6060343AMay 9, 2000
Method of forming an integrated circuit device having cyanate ester buffer coat
MICRON TECHNOLOGY INC2 citations62
US6579746B2Jun 17, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC0 citations52