Inventor
MOTODA KIMIO
JP21 patents
Patents
21 patentsUS5718763AFeb 17, 1998
Resist processing apparatus for a rectangular substrate
TOKYO ELECTRON LTD154 citations99
US5919520AJul 6, 1999
Coating method and apparatus for semiconductor process
TOKYO ELECTRON LTD105 citations98
US5762708AJun 9, 1998
Coating apparatus therefor
TOKYO ELECTRON LTD107 citations98
US6749688B2Jun 15, 2004
Coating method and apparatus for semiconductor process
TOKYO ELECTRON LTD47 citations96
US5803970ASep 8, 1998
Method of forming a coating film and coating apparatus
TOKYO ELECTRON LTD82 citations96
US5695817ADec 9, 1997
Method of forming a coating film
TOKYO ELECTRON LTD92 citations96
US5688322ANov 18, 1997
Apparatus for coating resist on substrate
TOKYO ELECTRON LTD89 citations96
US6159288ADec 12, 2000
Method and apparatus for cleaning treatment
TOKYO ELECTRON LTD57 citations95
US6010570AJan 4, 2000
Apparatus for forming coating film for semiconductor processing
TOKYO ELECTRON LTD67 citations95
US6514343B1Feb 4, 2003
Coating apparatus
TOKYO ELECTRON LTD52 citations92
US6168665B1Jan 2, 2001
Substrate processing apparatus
TOKYO ELECTRON LTD46 citations92
US6013317AJan 11, 2000
Coating apparatus and method therefor
TOKYO ELECTRON LTD38 citations92
US5906860AMay 25, 1999
Apparatus for treating a substrate with resist and resist-treating method
TOKYO ELECTRON LTD49 citations92
US5853812ADec 29, 1998
Method and apparatus for processing substrates
TOKYO ELECTRON LTD40 citations92
US7905195B2Mar 15, 2011
Floating-type substrate conveying and processing apparatus
TOKYO ELECTRON LTD34 citations91
US6058544AMay 9, 2000
Scrubbing apparatus and scrubbing method
TOKYO ELECTRON LTD17 citations83
US5853803ADec 29, 1998
Resist processing method and apparatus
TOKYO ELECTRON LTD12 citations74
US6398879B1Jun 4, 2002
Method and apparatus for cleaning treatment
TOKYO ELECTRON LTD10 citations73
US9238245B2Jan 19, 2016
Coating apparatus and method for filling coating liquid
TOKYO ELECTRON LTD5 citations72
US11482431B2Oct 25, 2022
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations49
US10964563B2Mar 30, 2021
Bonding apparatus and bonding method
TOKYO ELECTRON LTD0 citations48