Inventor
FLUEGEL JAMES E
US10 patents
Patents
10 patentsUS6471845B1Oct 29, 2002
Method of controlling chemical bath composition in a manufacturing environment
IBM63 citations95
US6395164B1May 28, 2002
Copper seed layer repair technique using electroless touch-up
IBM36 citations92
US6270646B1Aug 7, 2001
Electroplating apparatus and method using a compressible contact
IBM82 citations92
US7407605B2Aug 5, 2008
Manufacturable CoWP metal cap process for copper interconnects
IBM8 citations73
US6077405AJun 20, 2000
Method and apparatus for making electrical contact to a substrate during electroplating
IBM11 citations71
US7678258B2Mar 16, 2010
Void-free damascene copper deposition process and means of monitoring thereof
IBM1 citations51
US7253106B2Aug 7, 2007
Manufacturable CoWP metal cap process for copper interconnects
IBM1 citations51
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51
US6241868B1Jun 5, 2001
Method for electroplating a film onto a substrate
IBM0 citations49
US7901490B2Mar 8, 2011
Reducing introduction of foreign material to wafers
IBM0 citations45