Inventor
MALHOTRA ASHWANI K
US11 patents
Patents
11 patentsUS6036809AMar 14, 2000
Process for releasing a thin-film structure from a substrate
IBM112 citations98
US6183588B1Feb 6, 2001
Process for transferring a thin-film structure to a substrate
IBM52 citations95
US6143117ANov 7, 2000
Process for transferring a thin-film structure to a temporary carrier
IBM28 citations92
US6077405AJun 20, 2000
Method and apparatus for making electrical contact to a substrate during electroplating
IBM11 citations71
US6002267ADec 14, 1999
In-line voltage plane tests for multi-chip modules
IBM14 citations71
US6235412B1May 22, 2001
Corrosion-resistant terminal metal pads for thin film packages
IBM4 citations62
US6083375AJul 4, 2000
Process for producing corrosion-resistant terminal metal pads for thin film packages
IBM5 citations62
US6241868B1Jun 5, 2001
Method for electroplating a film onto a substrate
IBM0 citations49
US7851911B2Dec 14, 2010
Semiconductor chip used in flip chip process
IBM0 citations48
US7674637B2Mar 9, 2010
Monitoring cool-down stress in a flip chip process using monitor solder bump structures
IBM1 citations48
US6188124B1Feb 13, 2001
Semiconductor arrangement preventing damage during contact processing
IBM0 citations48