Inventor
WOZNIAK MICHAEL
US21 patents
⚠️ This page may combine multiple inventors who share the name “WOZNIAK MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS6630743B2Oct 7, 2003
Copper plated PTH barrels and methods for fabricating
IBM53 citations96
US6291779B1Sep 18, 2001
Fine pitch circuitization with filled plated through holes
IBM52 citations94
US6264851B1Jul 24, 2001
Selective seed and plate using permanent resist
IBM20 citations92
US6221694B1Apr 24, 2001
Method of making a circuitized substrate with an aperture
IBM31 citations92
US6188027B1Feb 13, 2001
Protection of a plated through hole from chemical attack
IBM22 citations92
US6618940B2Sep 16, 2003
Fine pitch circuitization with filled plated through holes
IBM19 citations91
US6467160B1Oct 22, 2002
Fine pitch circuitization with unfilled plated through holes
IBM25 citations90
US5759427AJun 2, 1998
Method and apparatus for polishing metal surfaces
IBM21 citations85
US6537608B2Mar 25, 2003
Protection of a plated through hole from chemical attack
IBM13 citations83
US6469256B1Oct 22, 2002
Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
IBM10 citations71
US5893983AApr 13, 1999
Technique for removing defects from a layer of metal
IBM12 citations68
US6093335AJul 25, 2000
Method of surface finishes for eliminating surface irregularities and defects
IBM6 citations61
US6547974B1Apr 15, 2003
Method of producing fine-line circuit boards using chemical polishing
IBM6 citations59
US5489500AFeb 6, 1996
Flexible strip structure for a parallel processor and method of fabricating the flexible strip
IBM6 citations56
US6776852B2Aug 17, 2004
Process of removing holefill residue from a metallic surface of an electronic substrate
IBM0 citations52
US6845557B2Jan 25, 2005
Method for producing an electronic package possessing controlled impedance characteristics
IBM1 citations49
ENDICOTT INTERCONNECT TECH INC
3 patentsUS7169313B2Jan 30, 2007
Plating method for circuitized substrates
ENDICOTT INTERCONNECT TECH INC13 citations83
US7383629B2Jun 10, 2008
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
ENDICOTT INTERCONNECT TECH INC6 citations74
US7838776B2Nov 23, 2010
Circuitized substrates utilizing smooth-sided conductive layers as part thereof
ENDICOTT INTERCONNECT TECH INC1 citations63