Inventor

LO RANDY H Y

TW27 patents

⚠️ This page may combine multiple inventors who share the name “LO RANDY H Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LO RANDY H Y

SILICONWARE PRECISION INDUSTRIES CO LTD

Flip chip type quad flat non-leaded package

Structure of a multi chip module having stacked chips

Stacked-die package structure

Multiple stacked-chip packaging structure

Multi-chip packaging structure

Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Integration of heat conducting apparatus and chip carrier in IC package

Ball grid array semiconductor package with exposed base layer

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Stacked multi-chip package structure with on-chip integration of passive component

Method of fabricating a ball grid array integrated circuit package having an encapsulating body

Multi-chip module package structure

Wafer level packaging process of semiconductor

Circuit probing contact pad formed on a bond pad in a flip chip package

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of forming solder areas over a lead frame

Method of wire bonding for small clearance

Method of packaging multi chip module

Flash-preventing semiconductor package

NAT SEMICONDUCTOR CORP

Structure for attaching a lead frame to a heat spreader/heat slug structure

Method for attaching a lead frame to a heat spreader/heat slug structure

SILICON PREC IND CO LTD

Package structure stacking chips on front surface and back surface of substrate

SILICONEWARE PREC IND CO LTD

Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip