Inventor
MCGREGOR PAUL
US8 patents
⚠️ This page may combine multiple inventors who share the name “MCGREGOR PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS6977224B2Dec 20, 2005
Method of electroless introduction of interconnect structures
INTEL CORP50 citations96
US6696758B2Feb 24, 2004
Interconnect structures and a method of electroless introduction of interconnect structures
INTEL CORP57 citations96
US6800554B2Oct 5, 2004
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP47 citations93
US7220674B2May 22, 2007
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP15 citations89
US6977220B2Dec 20, 2005
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP12 citations81
US6794755B2Sep 21, 2004
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement
INTEL CORP11 citations72
US7438794B2Oct 21, 2008
Method of copper electroplating to improve gapfill
INTEL CORP0 citations46