Inventor
JIN SHU
US5 patents
⚠️ This page may combine multiple inventors who share the name “JIN SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS5792522AAug 11, 1998
High density plasma physical vapor deposition
INTEL CORP65 citations94
US6800554B2Oct 5, 2004
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP47 citations93
US7220674B2May 22, 2007
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP15 citations89
US6977220B2Dec 20, 2005
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP12 citations81