Inventor
KIM MIN-IL
KR4 patents
Patents
4 patentsUS7227086B2Jun 5, 2007
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD21 citations90
US7005577B2Feb 28, 2006
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD11 citations81
US7096914B2Aug 29, 2006
Apparatus for bonding a chip using an insulating adhesive tape
SAMSUNG ELECTRONICS CO LTD6 citations61
US7410832B2Aug 12, 2008
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD4 citations60