Inventor · disambiguated record
Qiong Yu
Also filed as: YU QIONG · YU QIONG J
16 granted patents·3 pending applications·71 citations·filing 2001–2016
89Inventor score
Top patents by PatentIndex Score
19 records- 0184US10133907B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 20, 2018·5 cites·20 claims
- 0284US6829754B1Method and system for checking for power errors in ASIC designsLSI LOGIC CORP·Filed 2002·Granted Dec 7, 2004·48 cites·60 claims
- 0372US10090217B2Chip packaging method and package structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 2, 2018·2 cites·16 claims
- 0469US9748162B2Chip to wafer package with top electrodes and method of formingCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Aug 29, 2017·2 cites·15 claims
- 0567US9305961B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·4 claims
- 0663US10126151B2Wafer-level chip package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 13, 2018·1 cites·23 claims
- 0761US10108837B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·19 claims
- 0861US9601531B2Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regionsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·8 claims
- 0955US6560761B1Method of datapath cell placement for bitwise and non-bitwise integrated circuit designsLSI LOGIC CORP·Filed 2001·Granted May 6, 2003·9 cites·10 claims
- 1047US9231018B2Wafer level packaging structure for image sensors and wafer level packaging method for image sensorsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·18 claims
- 1145US9299735B2Image sensor package structure and methodCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 29, 2016·0 cites·38 claims
- 1244US9455298B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Sep 27, 2016·0 cites·7 claims
- 1341US6496967B1Method of datapath cell placement for an integrated circuitLSI LOGIC CORP·Filed 2001·Granted Dec 17, 2002·0 cites·5 claims
- 1436US10529758B2Packaging method and packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Jan 7, 2020·0 cites·9 claims
- 1534US10096643B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·15 claims
- 1633US2018129848A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 1733US2018108585A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 1833US2018114048A1Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 1932US8748669B2Process for producing aldehydes or ketones by oxidizing alcohols with oxygenMA SHENGMING·Filed 2010·Granted Jun 10, 2014·0 cites·6 claims
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