P

Inventor

SAKURAI SEIJI

JP8 patents
⚠️ This page may combine multiple inventors who share the name “SAKURAI SEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NICHIAS CORP

3 patents
US4755228AJul 5, 1988

Molding material

NICHIAS CORP25 citations89
US4622070ANov 11, 1986

Fibrous composite material for fused aluminum

NICHIAS CORP14 citations70
US5362033ANov 8, 1994

Hot plate for keeping molten metal in a molten state

NICHIAS CORP6 citations52

TEL SAGAMI LTD

2 patents
US5229576AJul 20, 1993

Heating apparatus

TEL SAGAMI LTD20 citations81
US5323484AJun 21, 1994

Heating apparatus with multilayer insulating structure

TEL SAGAMI LTD14 citations72

TOSHIBA KK

2 patents
US10718789B2Jul 21, 2020

Common test board, IP evaluation board, and semiconductor device test method

TOSHIBA KK0 citations47
US10101359B2Oct 16, 2018

Common test board, IP evaluation board, and semiconductor device test method

TOSHIBA KK1 citations47

WACOM CO LTD

1 patent
US12299249B2May 13, 2025

Sensor board and display device

WACOM CO LTD0 citations58