Inventor

MEKONNEN YIDNEKACHEW S

US18 patents

⚠️ This page may combine multiple inventors who share the name “MEKONNEN YIDNEKACHEW S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEKONNEN YIDNEKACHEW S

INTEL CORP

Integrated circuit package stack

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Rlink—die to die channel interconnect configurations to improve signaling

Package-integrated microchannels

Multiple die package using an embedded bridge connecting dies

Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line

Minimization of insertion loss variation in through-silicon vias (TSVs)

Low loss and low cross talk transmission lines having l-shaped cross sections

EMIB copper layer for signal and power routing

Package power delivery using plane and shaped vias

Package power delivery using plane and shaped vias

Multiple die package using an embedded bridge connecting dies

Package pin pattern for device-to-device connection

Tunable passive semiconductor elements

Simplified multimode signaling techniques

ALTUNYURT NEVIN

Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects