Inventor
YAGYU YUKI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “YAGYU YUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
5 patentsUS10128130B2Nov 13, 2018
Method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP2 citations70
US9972598B2May 15, 2018
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP3 citations70
US9293436B2Mar 22, 2016
Bonding wire to bonding pad
RENESAS ELECTRONICS CORP5 citations70
US10381318B2Aug 13, 2019
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations38
US10347604B2Jul 9, 2019
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations38
DENSO CORP
4 patentsUS11128069B2Sep 21, 2021
Electronic device and press-fit terminal
DENSO CORP2 citations70
US10680360B2Jun 9, 2020
Press-fit terminal and electronic device including press-fit terminal
DENSO CORP6 citations70
US11322859B2May 3, 2022
Electronic device and insulation-displacement terminal
DENSO CORP0 citations49
US10535931B2Jan 14, 2020
Wire connection device
DENSO CORP0 citations38