Inventor

KARHADE OMKAR G

US59 patents

⚠️ This page may combine multiple inventors who share the name “KARHADE OMKAR G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KARHADE OMKAR G

INTEL CORP

Integrated circuit package with embedded bridge

Embedded multi-device bridge with through-bridge conductive via signal connection

Low cost package warpage solution

Microelectronic structures including bridges

Microelectronic structures including bridges

Low cost package warpage solution

Integrated circuit package with embedded bridge

Integrated circuit package with embedded bridge

Picture frame stiffeners for microelectronic packages

Underfill material flow control for reduced die-to-die spacing in semiconductor packages

Microelectronic structures including bridges

Photonic integrated circuit packaging architectures

Photonic integrated circuit packaging architectures

Low cost package warpage solution

Embedded multi-device bridge with through-bridge conductive via signal connection

Embedded multi-device bridge with through-bridge conductive via signal connection

High bandwidth, low profile multi-die package

Thermal interfaces for integrated circuit packages

Warpage control for microelectronics packages

Nested glass packaging architecture for hybrid electrical and optical communication devices

Covered cavity for a photonic integrated circuit (PIC)

Reduced bridge structure for a photonic integrated circuit

Microelectronic package with substrate cavity for bridge-attach

Low cost package warpage solution

Microelectronic structures including bridges

Microelectronic structures including bridges

Low cost package warpage solution

Microelectronic structures including bridges

Antenna boards and communication devices

Methods of utilizing low temperature solder assisted mounting techniques for package structures

Mold material architecture for package device structures

Method and materials for warpage thermal and interconnect solutions

High density interconnection of microelectronic devices

Package architecture of photonic system with vertically stacked dies having planarized edges

Photonic integrated circuit packaging architecture

Warpage control for microelectronics packages

Microelectronic assemblies including interconnects with different solder materials

Integrated circuit package with flipped high bandwidth memory device

Microelectronic assemblies with through die attach film connections

Microelectronic structures including bridges

Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects

Microelectronic structures including bridges

Template structure for quasi-monolithic die architectures

Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer

Microelectronic structures including bridges

KARHADE OMKAR G

Methods to form high density through-mold interconnections

Reliable microstrip routing for electronics components

Reliable microstrip routing for electronics components

Reliable microstrip routing for electronics components

TAHOE RES LTD

Underfill material flow control for reduced die-to-die spacing in semiconductor packages