Inventor
HOSODA NAOYUKI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “HOSODA NAOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI METAL CORP
8 patentsUS4676827AJun 30, 1987
Wire for bonding a semiconductor device and process for producing the same
MITSUBISHI METAL CORP23 citations82
US4885135ADec 5, 1989
Fine gold alloy wire for bonding of a semi-conductor device
MITSUBISHI METAL CORP23 citations81
US3944414AMar 16, 1976
Treatment of anode slime from copper electrolysis
MITSUBISHI METAL CORP20 citations75
US4717436AJan 5, 1988
Wire for bonding a semiconductor device
MITSUBISHI METAL CORP10 citations74
US5071619ADec 10, 1991
Fine gold alloy wire for bonding of a semiconductor device
MITSUBISHI METAL CORP13 citations73
US4726859AFeb 23, 1988
Wire for bonding a semiconductor device
MITSUBISHI METAL CORP13 citations71
US4663141AMay 5, 1987
Process for recovering or purifying selenium
MITSUBISHI METAL CORP7 citations71
US4512950AApr 23, 1985
Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices
MITSUBISHI METAL CORP10 citations71