Inventor

KAWANAKA RYUSUKE

JP2 patents

Patents

2 patents

US4726859AFeb 23, 1988

Wire for bonding a semiconductor device

MITSUBISHI METAL CORP13 citations71

US4512950AApr 23, 1985

Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices

MITSUBISHI METAL CORP10 citations71