Inventor
SASE SHIGEO
10 patents
⚠️ This page may combine multiple inventors who share the name “SASE SHIGEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
9 patentsUS6696155B1Feb 24, 2004
Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances
HITACHI CHEMICAL CO LTD34 citations92
US6156831ADec 5, 2000
Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
HITACHI CHEMICAL CO LTD18 citations90
US4283319AAug 11, 1981
Process for preparing foundry cores or molds and binder materials used therefor
HITACHI CHEMICAL CO LTD22 citations79
US6572968B2Jun 3, 2003
Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards
HITACHI CHEMICAL CO LTD11 citations73
US6329474B1Dec 11, 2001
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole
HITACHI CHEMICAL CO LTD10 citations73
US4362203ADec 7, 1982
Process for preparing foundry cores or molds and binder materials used therefor
HITACHI CHEMICAL CO LTD9 citations70
US6180250B1Jan 30, 2001
Epoxy composition for printed circuit boards
HITACHI CHEMICAL CO LTD5 citations62
US6465083B1Oct 15, 2002
Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the composition
HITACHI CHEMICAL CO LTD3 citations60
US6692792B2Feb 17, 2004
Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
HITACHI CHEMICAL CO LTD0 citations51