Inventor
LEIPHART SHANE P
US20 patents
Patents
20 patentsUS7456452B2Nov 25, 2008
Light sensor having undulating features for CMOS imager
MICRON TECHNOLOGY INC53 citations96
US5985102ANov 16, 1999
Kit for electrically isolating collimator of PVD chamber, chamber so modified, and method of using
MICRON TECHNOLOGY INC62 citations96
US5783282AJul 21, 1998
Resputtering to achieve better step coverage of contact holes
MICRON TECHNOLOGY INC50 citations96
US6833623B2Dec 21, 2004
Enhanced barrier liner formation for via
MICRON TECHNOLOGY INC15 citations92
US6660136B2Dec 9, 2003
Method of forming a non-volatile resistance variable device and method of forming a metal layer comprising silver and tungsten
MICRON TECHNOLOGY INC22 citations92
US6346177B2Feb 12, 2002
Method of in-situ cleaning and deposition of device structures in a high density plasma environment
MICRON TECHNOLOGY INC17 citations92
US6323124B1Nov 27, 2001
Resputtering to achieve better step coverage
MICRON TECHNOLOGY INC16 citations92
US6187151B1Feb 13, 2001
Method of in-situ cleaning and deposition of device structures in a high density plasma environment
MICRON TECHNOLOGY INC25 citations92
US5705042AJan 6, 1998
Electrically isolated collimator and method
MICRON TECHNOLOGY INC28 citations86
US5997699ADec 7, 1999
Insitu faceting during deposition
MICRON TECHNOLOGY INC19 citations84
US5882488AMar 16, 1999
Resputtering to achieve better step coverage
MICRON TECHNOLOGY INC13 citations82
US6828233B2Dec 7, 2004
Enhanced barrier liner formation for vias
MICRON TECHNOLOGY INC11 citations73
US6800180B1Oct 5, 2004
Resputtering to achieve better step coverage
MICRON TECHNOLOGY INC4 citations73
US6224942B1May 1, 2001
Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon
MICRON TECHNOLOGY INC8 citations73
US6090246AJul 18, 2000
Methods and apparatus for detecting reflected neutrals in a sputtering process
MICRON TECHNOLOGY INC7 citations73
US5928480AJul 27, 1999
Methods of sputter depositing of metals onto substrates, and methods of forming plasma
MICRON TECHNOLOGY INC8 citations73
US5667645ASep 16, 1997
Method of sputter deposition
MICRON TECHNOLOGY INC8 citations73
US6057235AMay 2, 2000
Method for reducing surface charge on semiconducter wafers to prevent arcing during plasma deposition
MICRON TECHNOLOGY INC14 citations72
US7163893B2Jan 16, 2007
Advanced barrier liner formation for vias
MICRON TECHNOLOGY INC1 citations62
US6258718B1Jul 10, 2001
Method for reducing surface charge on semiconductor wafers to prevent arcing during plasma deposition
MICRON TECHNOLOGY INC1 citations51