Inventor
MIYANO FUMIO
JP8 patents
Patents
8 patentsUS6491202B1Dec 10, 2002
Wire bonding apparatus and method
SHINKAWA KK23 citations91
US5957371ASep 28, 1999
Method and apparatus for forming a ball in wire bonding
SHINKAWA KK8 citations73
US6467679B2Oct 22, 2002
Wire bonding method
SHINKAWA KK11 citations72
US5958259ASep 28, 1999
Method for forming a ball in wire bonding
SHINKAWA KK11 citations72
US7644852B2Jan 12, 2010
Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
SHINKAWA KK7 citations69
US7658313B2Feb 9, 2010
Ball forming device in a bonding apparatus and ball forming method
SHINKAWA KK5 citations61
US7299966B2Nov 27, 2007
Initial ball forming method for wire bonding wire and wire bonding apparatus
SHINKAWA KK3 citations61
US6874673B2Apr 5, 2005
Initial ball forming method for wire bonding wire and wire bonding apparatus
SHINKAWA KK5 citations61