Inventor
LEOW SEE HIONG
SG12 patents
⚠️ This page may combine multiple inventors who share the name “LEOW SEE HIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
9 patentsUS7741150B2Jun 22, 2010
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
MICRON TECHNOLOGY INC12 citations90
US9147623B2Sep 29, 2015
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
MICRON TECHNOLOGY INC5 citations83
US12476216B2Nov 18, 2025
Wire bonding for stacked memory dies
MICRON TECHNOLOGY INC0 citations60
US12463140B2Nov 4, 2025
Flexible interposer for semiconductor dies
MICRON TECHNOLOGY INC0 citations60
US8900923B2Dec 2, 2014
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
MICRON TECHNOLOGY INC1 citations60
US12581976B2Mar 17, 2026
Wire bonding directly on exposed conductive vias and interconnects and related systems and methods
MICRON TECHNOLOGY INC0 citations51
US12412811B2Sep 9, 2025
Split via structure for semiconductor device packaging
MICRON TECHNOLOGY INC0 citations51
US8803307B2Aug 12, 2014
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
MICRON TECHNOLOGY INC0 citations51
US9324676B2Apr 26, 2016
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
MICRON TECHNOLOGY INC0 citations49