Inventor

DUROCHER KEVIN MATTHEW

US52 patents

⚠️ This page may combine multiple inventors who share the name “DUROCHER KEVIN MATTHEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUROCHER KEVIN MATTHEW

GEN ELECTRIC

Flexible interconnect film including resistor and capacitor layers

Fabrication method for thin film capacitors

Plastic packaging of LED arrays

Plastic packaging of LED arrays

Method for aligning die to interconnect metal on flex substrate

Method for fabricating a stack of two dimensional circuit modules

Method for fabricating a flexible interconnect film with resistor and capacitor layers

Amorphous hydrogenated carbon hermetic structure and fabrication method

Multilayer capacitors using amorphous hydrogenated carbon

Stacking of three dimensional high density interconnect modules with metal edge contacts

Process for fabricating a tool used in electrochemical machining

Microelectromechanical system device packaging method

Microelectromechanical system device packaging method

Plastic packaging of LED arrays

Structure for thin film capacitors

Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby

Power semiconductor module and fabrication method

Hermetically sealed fiber sensing cable

Ultrasound probe assembly and method of fabrication

Method of making an electronic device cooling system

Method of processing high-resolution flex circuits with low distortion

Interconnection structure with etch stop

Interconnection method using an etch stop

Amorphous hydrogenated carbon hermetic structure fabrication method

Scaled adaptive lithography

Methods and systems for a flexible circuit

Ultra thin die electronic package

Electronic interconnects and methods of making same

Apparatus for aligning die to interconnect metal on flex substrate

Electrical interconnect for an integrated circuit package and method of making same

System and a method for controlling flow of solder

Electrical interconnect for an integrated circuit package and method of making same

Electrical interconnect for an integrated circuit package and method of making same

Electrical interconnect for an integrated circuit package and method of making same

High density interconnect multichip module stack and fabrication method

System of chip package build-up

MCCONNELEE PAUL ALAN

Electrical interconnect for an integrated circuit package and method of making same

Method of chip package build-up

Component protection for advanced packaging applications

LOCKHEED CORP

Method for making multichip module substrates by encapsulating electrical conductors and filling gaps

Affordable high performance high frequency multichip module fabrication and apparatus

WODNICKI ROBERT GIDEON

Ultrasound acoustic assemblies and methods of manufacture

Methods of making and using integrated and testable sensor array

SHAW JEFFREY JON

Apparatus for reducing scattered X-ray detection and method of same

Anti-scatter X-ray grid device and method of making same

DELGADO ELADIO CLEMENTE

Power semiconductor module and fabrication method

TKACZYK JOHN ERIC

Detector modules for imaging systems and methods of manufacturing

SHADDOCK DAVID MULFORD

Article including thermal interface element and method of preparation

FILLION RAYMOND ALBERT

Interconnect structure

GOWDA ARUN VIRUPAKSHA

Circuit board including mask for controlling flow of solder