Inventor
CORONA PIETRO
IT23 patents
⚠️ This page may combine multiple inventors who share the name “CORONA PIETRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS SRL
17 patentsUS7294536B2Nov 13, 2007
Process for manufacturing an SOI wafer by annealing and oxidation of buried channels
ST MICROELECTRONICS SRL45 citations96
US6376291B1Apr 23, 2002
Process for manufacturing buried channels and cavities in semiconductor material wafers
ST MICROELECTRONICS SRL56 citations96
US7452713B2Nov 18, 2008
Process for manufacturing a microfluidic device with buried channels
ST MICROELECTRONICS SRL39 citations93
US8008738B2Aug 30, 2011
Integrated differential pressure sensor
ST MICROELECTRONICS SRL18 citations92
US7763487B2Jul 27, 2010
Integrated differential pressure sensor and manufacturing process thereof
ST MICROELECTRONICS SRL42 citations92
US7678600B2Mar 16, 2010
Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate
ST MICROELECTRONICS SRL24 citations92
US6992367B2Jan 31, 2006
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity
ST MICROELECTRONICS SRL18 citations92
US6693039B2Feb 17, 2004
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity
ST MICROELECTRONICS SRL17 citations92
US6362070B1Mar 26, 2002
Process for manufacturing a SOI wafer with buried oxide regions without cusps
ST MICROELECTRONICS SRL23 citations92
US7846811B2Dec 7, 2010
Process for manufacturing a high-quality SOI wafer
ST MICROELECTRONICS SRL11 citations84
US7811848B2Oct 12, 2010
Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
ST MICROELECTRONICS SRL12 citations84
US7071073B2Jul 4, 2006
Process for manufacturing low-cost and high-quality SOI substrates
ST MICROELECTRONICS SRL18 citations84
US7754578B2Jul 13, 2010
Process for manufacturing a wafer by annealing of buried channels
ST MICROELECTRONICS SRL5 citations74
US8344466B2Jan 1, 2013
Process for manufacturing MEMS devices having buried cavities and MEMS device obtained thereby
ST MICROELECTRONICS SRL5 citations70
US7906406B2Mar 15, 2011
Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured
ST MICROELECTRONICS SRL4 citations63
US6759132B2Jul 6, 2004
Method for the manufacture of electromagnetic radiation reflecting devices
ST MICROELECTRONICS SRL4 citations63
US7871894B2Jan 18, 2011
Process for manufacturing thick suspended structures of semiconductor material
ST MICROELECTRONICS SRL1 citations52
VILLA FLAVIO FRANCESCO
2 patentsBARLOCCHI GABRIELE
2 patentsUS9105690B2Aug 11, 2015
Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured
BARLOCCHI GABRIELE0 citations48
US8420428B2Apr 16, 2013
Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
BARLOCCHI GABRIELE1 citations48