Inventor
TSENG JIA-HUNG
US7 patents
⚠️ This page may combine multiple inventors who share the name “TSENG JIA-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS10242892B2Mar 26, 2019
Micro pick and bond assembly
INTEL CORP5 citations82
US10886153B2Jan 5, 2021
Display including an LED element having a pressure sensitive adhesive (PSA) for micro pick and bond assembly of the display
INTEL CORP1 citations60
US9420700B2Aug 16, 2016
Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
INTEL CORP1 citations49