P

Inventor

AKIBA TOSHIHIKO

JP20 patents
⚠️ This page may combine multiple inventors who share the name “AKIBA TOSHIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS ELECTRONICS CORP

15 patents
US7847413B2Dec 7, 2010

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP24 citations92
US9646901B2May 9, 2017

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

RENESAS ELECTRONICS CORP3 citations84
US10163791B2Dec 25, 2018

Semiconductor device

RENESAS ELECTRONICS CORP8 citations83
US10566255B2Feb 18, 2020

Method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP2 citations73
US9293436B2Mar 22, 2016

Bonding wire to bonding pad

RENESAS ELECTRONICS CORP5 citations70
US9911673B2Mar 6, 2018

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

RENESAS ELECTRONICS CORP1 citations62
US8912540B2Dec 16, 2014

Semiconductor device

RENESAS ELECTRONICS CORP2 citations62
US11784173B2Oct 10, 2023

Semiconductor device including a circuit for transmitting a signal

RENESAS ELECTRONICS CORP0 citations61
US11158617B2Oct 26, 2021

Semiconductor device including a circuit for transmitting a signal

RENESAS ELECTRONICS CORP1 citations61
US11063009B2Jul 13, 2021

Semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US10134648B2Nov 20, 2018

Manufacturing method of semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US9165845B2Oct 20, 2015

Semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US12148680B2Nov 19, 2024

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP0 citations48
US10128129B2Nov 13, 2018

Method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP1 citations47
US9711377B2Jul 18, 2017

Method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP1 citations47

AKIBA TOSHIHIKO

4 patents

NIDEC TOSOK CORP

1 patent