Inventor

LI CHIEN-CHEN

TW22 patents

⚠️ This page may combine multiple inventors who share the name “LI CHIEN-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI CHIEN-CHEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method for forming semiconductor device structure with bumps

Systems for semiconductor package mounting with improved co-planarity

Semiconductor device and method

Structure and formation method of chip package with protective lid

Chip package structure including ring-like structure and method for forming the same

Method for forming package structure including intermetallic compound

Dummy through vias for integrated circuit packages and methods of forming the same

Semiconductor device and method

Heat dissipating features for laser drilling process

Package structure with protective lid

Chip package structure with ring-like structure

Chip package structure with ring-like structure

Chip package structure with ring-like structure

Package structure with a barrier layer

Method for forming package structure with a barrier layer

Multi-die package and methods of formation

Method for forming probe head structure

Package structure with a barrier layer and method for forming the same

Immersion de-taping

Immersion de-taping

TAIWAN SEMICONDUCTOR MFG

Two step molding grinding for packaging applications

UNIV CHUNG YUAN CHRISTIAN

Process for fabricating non-volatile memory by tilt-angle ion implantation