Inventor

TAI SHIH-PENG

TW27 patents

⚠️ This page may combine multiple inventors who share the name “TAI SHIH-PENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAI SHIH-PENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package with probe pad structure

Chip-on-substrate packaging on carrier

Integrated fan-out package and method of fabricating the same

Alignment pattern for package singulation

Adding sealing material to wafer edge for wafer bonding

Thermal structure for semiconductor device and method of forming the same

Semiconductor package and method for manufacturing the same

Package structure

Semiconductor package and method for manufacturing the same

Package structure

Package structure and manufacturing method thereof

Integrated circuit packages and methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor structure having through substrate via and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor devices, multi-die packages, and methods of manufacure thereof

Semiconductor devices, multi-die packages, and methods of manufacture thereof

Chip-on-substrate packaging on carrier

Chip-on-substrate packaging on carrier

Chip-on-substrate packaging on carrier

Lithography process for semiconductor packaging and structures resulting therefrom

AU OPTRONICS CORP

Multi-domain vertical alignment liquid crystal display

In-plane switching mode liquid crystal display having heightened electrodes

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Structure and formation method of package with hybrid interconnection

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Methods of forming integrated circuit package