Inventor
OKIKAWA SUSUMU
JP15 patents
⚠️ This page may combine multiple inventors who share the name “OKIKAWA SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
12 patentsUS4998002AMar 5, 1991
Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
HITACHI LTD62 citations96
US5031821AJul 16, 1991
Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
HITACHI LTD56 citations95
US4845543AJul 4, 1989
Semiconductor device and method of manufacturing the same
HITACHI LTD72 citations94
US5285949AFeb 15, 1994
Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
HITACHI LTD36 citations92
US5152450AOct 6, 1992
Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
HITACHI LTD24 citations92
US4100566AJul 11, 1978
Resin-sealed type semiconductor devices and manufacturing method of the same
HITACHI LTD36 citations91
US4976393ADec 11, 1990
Semiconductor device and production process thereof, as well as wire bonding device used therefor
HITACHI LTD40 citations89
US4950866AAug 21, 1990
Method and apparatus of bonding insulated and coated wire
HITACHI LTD38 citations88
US4791472ADec 13, 1988
Lead frame and semiconductor device using the same
HITACHI LTD26 citations86
US4564734AJan 14, 1986
Wire bonder
HITACHI LTD24 citations82
US4326215AApr 20, 1982
Encapsulated semiconductor device with a metallic base plate
HITACHI LTD9 citations74
US4123293AOct 31, 1978
Method of providing semiconductor pellet with heat sink
HITACHI LTD14 citations69
HITACHI METALS LTD
3 patentsUS5844310ADec 1, 1998
Heat spreader semiconductor device with heat spreader and method for producing same
HITACHI METALS LTD45 citations93
US6419149B1Jul 16, 2002
Method for producing wiring layer transfer composite
HITACHI METALS LTD27 citations92
US6032362AMar 7, 2000
Method for producing a heat spreader and semiconductor device with a heat spreader
HITACHI METALS LTD38 citations89