Inventor

PENG YI-LIANG

TW5 patents

⚠️ This page may combine multiple inventors who share the name “PENG YI-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FIRST INT COMPUTER INC

2 patents

US6215180B1Apr 10, 2001

Dual-sided heat dissipating structure for integrated circuit package

FIRST INT COMPUTER INC141 citations94

US6160311ADec 12, 2000

Enhanced heat dissipating chip scale package method and devices

FIRST INT COMPUTER INC11 citations71

VATE TECHNOLOGY CO LTD

2 patents

US6633086B1Oct 14, 2003

Stacked chip scale package structure

VATE TECHNOLOGY CO LTD18 citations81

US6570263B1May 27, 2003

Structure of plated wire of fiducial marks for die-dicing package

VATE TECHNOLOGY CO LTD12 citations71

(unassigned)

1 patent

US6130477AOct 10, 2000

Thin enhanced TAB BGA package having improved heat dissipation

55 citations91