Inventor
YANG CHAUR-CHIN
TW5 patents
Patents
5 patentsUS7034388B2Apr 25, 2006
Stack type flip-chip package
ADVANCED SEMICONDUCTOR ENG73 citations96
US6861761B2Mar 1, 2005
Multi-chip stack flip-chip package
ADVANCED SEMICONDUCTOR ENG74 citations96
US6768190B2Jul 27, 2004
Stack type flip-chip package
ADVANCED SEMICONDUCTOR ENG141 citations96
US6717253B2Apr 6, 2004
Assembly package with stacked dies and signal transmission plate
ADVANCED SEMICONDUCTOR ENG37 citations90
US7473989B2Jan 6, 2009
Flip-chip package
ADVANCED SEMICONDUCTOR ENG9 citations82