Inventor
WANG HSUEH-TE
TW11 patents
⚠️ This page may combine multiple inventors who share the name “WANG HSUEH-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
8 patentsUS6258626B1Jul 10, 2001
Method of making stacked chip package
ADVANCED SEMICONDUCTOR ENG152 citations98
US7034388B2Apr 25, 2006
Stack type flip-chip package
ADVANCED SEMICONDUCTOR ENG73 citations96
US6768190B2Jul 27, 2004
Stack type flip-chip package
ADVANCED SEMICONDUCTOR ENG141 citations96
US7253508B2Aug 7, 2007
Semiconductor package with a flip chip on a solder-resist leadframe
ADVANCED SEMICONDUCTOR ENG24 citations92
US6153939ANov 28, 2000
Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same
ADVANCED SEMICONDUCTOR ENG22 citations92
US7164202B2Jan 16, 2007
Quad flat flip chip package and leadframe thereof
ADVANCED SEMICONDUCTOR ENG17 citations83
US7067904B2Jun 27, 2006
Flip-chip type quad flat package and leadframe
ADVANCED SEMICONDUCTOR ENG11 citations83
US7022551B2Apr 4, 2006
Quad flat flip chip packaging process and leadframe therefor
ADVANCED SEMICONDUCTOR ENG2 citations62
MEDIATEK INC
3 patentsUS10037936B2Jul 31, 2018
Semiconductor package with coated bonding wires and fabrication method thereof
MEDIATEK INC2 citations71
US10978406B2Apr 13, 2021
Semiconductor package including EMI shielding structure and method for forming the same
MEDIATEK INC0 citations51
US10685943B2Jun 16, 2020
Semiconductor chip package with resilient conductive paste post and fabrication method thereof
MEDIATEK INC0 citations51