Inventor
WU ENBOA
TW14 patents
⚠️ This page may combine multiple inventors who share the name “WU ENBOA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV NAT TAIWAN
5 patentsUS7203426B2Apr 10, 2007
Optical subassembly of optical transceiver
UNIV NAT TAIWAN50 citations92
US7943052B2May 17, 2011
Method for self-assembling microstructures
UNIV NAT TAIWAN22 citations91
US7351609B2Apr 1, 2008
Method for wafer level package of sensor chip
UNIV NAT TAIWAN5 citations59
US7271020B2Sep 18, 2007
Light emitting diode covered with a reflective layer and method for fabricating the same
UNIV NAT TAIWAN2 citations57
US7013066B1Mar 14, 2006
Tunable long period fiber grating structure and fabrication method
UNIV NAT TAIWAN3 citations54
IND TECH RES INST
4 patentsUS7511365B2Mar 31, 2009
Thermal enhanced low profile package structure
IND TECH RES INST74 citations97
US6459150B1Oct 1, 2002
Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer
IND TECH RES INST125 citations97
US6433427B1Aug 13, 2002
Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication
IND TECH RES INST110 citations96
US7754530B2Jul 13, 2010
Thermal enhanced low profile package structure and method for fabricating the same
IND TECH RES INST41 citations92