Inventor
SHIOZAWA MASAKUNI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “SHIOZAWA MASAKUNI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
13 patentsUS6391686B1May 21, 2002
Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
SEIKO EPSON CORP26 citations91
US7256072B2Aug 14, 2007
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
SEIKO EPSON CORP8 citations73
US6638785B2Oct 28, 2003
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making
SEIKO EPSON CORP12 citations72
US6566763B2May 20, 2003
Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument
SEIKO EPSON CORP9 citations72
US8008939B2Aug 30, 2011
Component test apparatus and component transport method
SEIKO EPSON CORP3 citations61
US7888928B2Feb 15, 2011
Component test apparatus having a pair of rotary transport hands
SEIKO EPSON CORP5 citations61
US7562806B2Jul 21, 2009
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
SEIKO EPSON CORP4 citations61
US7195935B2Mar 27, 2007
Selective packaging of tested semiconductor devices
SEIKO EPSON CORP2 citations61
US7017636B2Mar 28, 2006
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
SEIKO EPSON CORP4 citations61
US6984125B2Jan 10, 2006
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
SEIKO EPSON CORP2 citations61
US7410826B2Aug 12, 2008
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
SEIKO EPSON CORP0 citations51
US7371607B2May 13, 2008
Method of manufacturing semiconductor device and method of manufacturing electronic device
SEIKO EPSON CORP0 citations51
US6512294B1Jan 28, 2003
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same
SEIKO EPSON CORP0 citations51