Inventor

TOMURA YOSHIHIRO

JP34 patents

⚠️ This page may combine multiple inventors who share the name “TOMURA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOMURA YOSHIHIRO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor device having a bump having a rugged side

Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method

Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex

Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device

Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

Method for mounting a semiconductor device on a circuit board

Methods for producing a chip carrier and terminal electrode for a circuit substrate

Method for planarizing circuit board and method for manufacturing semiconductor device

Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body

PANASONIC CORP

Interconnecting board and three-dimensional wiring structure using it

Substrate connecting member and connecting structure

Method for manufacturing an electrode and electrode component mounted body

Resin sealing structure for electronic component and resin sealing method for electronic component

Semiconductor chip and semiconductor device

Electrode junction structure and manufacturing method thereof

Semiconductor device

TOMURA YOSHIHIRO

Semiconductor device mounted structure and semiconductor device mounted method

Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

Semiconductor assembly and multilayer wiring board

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

IWASE TEPPEI

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

Semiconductor device mounted structure with an underfill sealing-bonding resin with voids

PILOT PEN CO LTD

Writing unit locking mechanism in a multiple-point writing implement including a mechanical pencil unit

Multiple-point writing instrument including a mechanical pencil unit

NIPPON OILS & FATS CO LTD

Curability-imparting composition, method for curing with said composition, and method for production of glass fiber-reinforced plastic

Visible light-curing polyester resin composition

NAKAMURA KOJIRO

Mounting structure and mounting method

PILOT KK

Device for advancing and retracting writing element in writing instrument

SHIMIZU KAZUMICHI

Semiconductor device and method of manufacturing the same

KONDOU SHIGERU

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

HIGUCHI TAKAYUKI

Method of manufacturing mounting structure and mounting structure

KUMAZAWA KENTARO

Semiconductor device having stable signal transmission at high speed and high frequency