Inventor
TAM SAMUEL
US12 patents
⚠️ This page may combine multiple inventors who share the name “TAM SAMUEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FLEXTRONICS AP LLC
4 patentsUS8385073B2Feb 26, 2013
Folded system-in-package with heat spreader
FLEXTRONICS AP LLC6 citations71
US9041019B2May 26, 2015
Method of and device for manufacturing LED assembly using liquid molding technologies
FLEXTRONICS AP LLC0 citations50
US9018749B2Apr 28, 2015
Stacked packages using laser direct structuring
FLEXTRONICS AP LLC1 citations46
US9748460B2Aug 29, 2017
LED back end assembly and method of manufacturing
FLEXTRONICS AP LLC0 citations37
TAM SAMUEL
3 patentsUS8642387B2Feb 4, 2014
Method of fabricating stacked packages using laser direct structuring
TAM SAMUEL7 citations77
US9136289B2Sep 15, 2015
Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
TAM SAMUEL4 citations69
US8913180B2Dec 16, 2014
Folded tape package for electronic devices
TAM SAMUEL0 citations48
META PLATFORMS TECH LLC
2 patentsAHMAD NAZIR
2 patentsUS8119450B2Feb 21, 2012
Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots
AHMAD NAZIR2 citations58
US9312150B2Apr 12, 2016
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
AHMAD NAZIR0 citations48