Inventor

KHANDROS IGOR Y

US193 patents

⚠️ This page may combine multiple inventors who share the name “KHANDROS IGOR Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KHANDROS IGOR Y

FORMFACTOR INC

Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods

Method and apparatus for shaping spring elements

Test assembly including a test die for testing a semiconductor product die

Method for manufacturing raised electrical contact pattern of controlled geometry

Microelectronic contact structures, and methods of making same

Wafer-level burn-in and test

Resilient contact structures for interconnecting electronic devices

Contact carriers (tiles) for populating larger substrates with spring contacts

Method of manufacturing a probe card

Method and apparatus for shaping spring elements

Large contactor with multiple, aligned contactor units

Method and apparatus for burning-in semiconductor devices in wafer form

Probe card assembly

Special contact points for accessing internal circuitry of an integrated circuit

Special contact points for accessing internal circuitry of an integrated circuit

Test assembly including a test die for testing a semiconductor product die

Method for manufacturing raised electrical contact pattern of controlled geometry

Sockets for “springed” semiconductor devices

Wafer-level burn-in and test

Microelectronic contact structures, and methods of making same

Microelectronic spring contact element and electronic component having a plurality of spring contact elements

Method of making microelectronic contact structures

Raised contact structures (solder columns)

Special contact points for accessing internal circuitry of an integrated circuit

Concurrent design and subsequent partitioning of product and test die

Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device

Interconnection substrates with resilient contact structures on both sides

Probe card assembly and kit, and methods of using same

Sockets for “springed” semiconductor devices

Method for manufacturing raised electrical contact pattern of controlled geometry

Method of making microelectronic spring contact elements

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Wafer-level burn-in and test

Method of mounting free-standing resilient electrical contact structures to electronic components

Making discrete power connections to a space transformer of a probe card assembly

Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals

Wafer-level test and burn-in, and semiconductor process

Sockets for &#34;springed&#34; semiconductor devices

Composite interconnection element for microelectronic components, and method of making same

Method of testing semiconductor

Stacking semiconductor devices, particularly memory chips

Fabricating interconnects and tips using sacrificial substrates

Method of temporarily, then permanently, connecting to a semiconductor device

TESSERA INC

Stacked chip assembly

Semiconductor chip assembly with anisotropic conductive adhesive connections

Methods of making semiconductor chip assemblies

Semiconductor connection components and methods with releasable lead support

(unassigned)

Method of fabricating an interconnection element

Sockets for "springed" semiconductor devices