Inventor

SASAKI HIDEAKI

JP76 patents

⚠️ This page may combine multiple inventors who share the name “SASAKI HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SASAKI HIDEAKI

HITACHI LTD

Laser cleavage cutting method and system

Computer-integrated manufacturing system and method

High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system

Printed circuit board, IC card, and manufacturing method thereof

Electronic circuit device and method of producing the same

Component alignment apparatus

Surface reformation method of high polymer material

Multi-chip-module

Printed circuit board assembling system

Method and apparatus for measuring the height of an object

Automatic wiring machine for printed circuit boards

Soldering method

Method for forming conductive bumps

Balance adjustment method of end mill

Grinding method, semiconductor device and method of manufacturing semiconductor device

Wire bonding method and apparatus

Vapor tank

Solder bump measuring method and apparatus

Parts-connecting apparatus using solder

Solder bump measuring method and apparatus

Printed circuit board with a uniform conductive layer formed by equalization of metals therein

Electronic circuit apparatus comprising a structure for sealing an electronic circuit

Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals

Paste providing method, soldering method and apparatus and system therefor

Thin electronic circuit component and method and apparatus for producing the same

Paste providing method, soldering method and apparatus and system therefor

Grinding method and grinding machine

Solder bump measuring method and apparatus

Surface reformation method of high polymer material

Laser assisted surface reformation method of high polymer material

Thin electronic circuit component and method and apparatus for producing the same

Paste providing method, soldering method and apparatus and system therefor

NEC CORP

Lithium-ion secondary battery

Lithium ion secondary battery

Lithium secondary battery

Electrolyte solution and secondary battery using same

TORAY INDUSTRIES

Sandwich structure, shaped product, and production processes therefor

Integrally molded body and method of producing same

Laminate and integrally molded article

SEKISUI PLASTICS

Process for producing expandable thermoplastic resin beads

Process for producing expandable thermoplastic resin beads using polypropylene as nucleus

SANYO ELECTRIC CO

Video signal processing device for writing and reading a video signal with respect to a memory according to different clocks, while preventing a write/read address pass-by in the memory

Offset adjusting circuit for optical disc and offset adjusting method

HONDA MOTOR CO LTD

Vehicle assembly line

TSUCHIYA ATSUKI

Prepreg, preform, molded product, and method for manufacturing prepreg

PROCTER & GAMBLE

Disposable diaper

JATCO LTD

Hydraulic pressure control device for continuously variable transmission

NIPPON STEEL CORP

Process for producing steel by converter

SANYO KOKUSAKU PULP CO

Method of forming an image

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

System identification method and its recording device