P

Inventor

ARIMA HIDEAKI

JP59 patents
⚠️ This page may combine multiple inventors who share the name “ARIMA HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

44 patents
US5049975ASep 17, 1991

Multi-layered interconnection structure for a semiconductor device

MITSUBISHI ELECTRIC CORP152 citations99
US5763921AJun 9, 1998

Semiconductor device including retrograde well structure with suppressed substrate bias effects

MITSUBISHI ELECTRIC CORP136 citations98
US6194758B1Feb 27, 2001

Semiconductor device comprising capacitor and method of fabricating the same

MITSUBISHI ELECTRIC CORP49 citations96
US5523596AJun 4, 1996

Semiconductor device having capacitor and manufacturing method therefor

MITSUBISHI ELECTRIC CORP53 citations96
US5486712AJan 23, 1996

DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof

MITSUBISHI ELECTRIC CORP36 citations96
US5378643AJan 3, 1995

Electrically programmable non-volatile semiconductor memory device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP50 citations96
US5162262ANov 10, 1992

Multi-layered interconnection structure for a semiconductor device and manufactured method thereof

MITSUBISHI ELECTRIC CORP57 citations96
US5051948ASep 24, 1991

Content addressable memory device

MITSUBISHI ELECTRIC CORP81 citations96
US5049516ASep 17, 1991

Method of manufacturing semiconductor memory device

MITSUBISHI ELECTRIC CORP69 citations96
US4465529AAug 14, 1984

Method of producing semiconductor device

MITSUBISHI ELECTRIC CORP81 citations96
US5101250AMar 31, 1992

Electrically programmable non-volatile memory device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP99 citations94
US6066881AMay 23, 2000

Integrated circuit having a memory cell transistor with a gate oxide layer which is thicker than the gate oxide layer of a peripheral circuit transistor

MITSUBISHI ELECTRIC CORP27 citations93
US5798289AAug 25, 1998

Method of manufacturing stacked capacitors in a DRAM with reduced isolation region between adjacent capacitors

MITSUBISHI ELECTRIC CORP20 citations93
US5612241AMar 18, 1997

Method of manufacturing a DRAM having peripheral circuitry in which source drain interconnection contact of a MOS transistor is made small by utilizing a pad layer

MITSUBISHI ELECTRIC CORP29 citations93
US5597755AJan 28, 1997

Method of manufacturing a stacked capacitor in a dram

MITSUBISHI ELECTRIC CORP25 citations93
US5480826AJan 2, 1996

Method of manufacturing semiconductor device having a capacitor

MITSUBISHI ELECTRIC CORP40 citations93
US5428239AJun 27, 1995

Semiconductor device having retrograde well and diffusion-type well

MITSUBISHI ELECTRIC CORP48 citations93
US5404042AApr 4, 1995

Semiconductor memory device having a plurality of well regions of different conductivities

MITSUBISHI ELECTRIC CORP26 citations93
US5381365AJan 10, 1995

Dynamic random access memory having stacked type capacitor and manufacturing method therefor

MITSUBISHI ELECTRIC CORP33 citations93
US5364811ANov 15, 1994

Method of manufacturing a semiconductor memory device with multiple device forming regions

MITSUBISHI ELECTRIC CORP26 citations93
US5218219AJun 8, 1993

Semiconductor memory device having a peripheral wall at the boundary region of a memory cell array region and a peripheral circuit region

MITSUBISHI ELECTRIC CORP35 citations93
US5194925AMar 16, 1993

Electrically programmable non-volatie semiconductor memory device

MITSUBISHI ELECTRIC CORP45 citations93
US5141891AAug 25, 1992

MIS-type semiconductor device of LDD structure and manufacturing method thereof

MITSUBISHI ELECTRIC CORP33 citations93
US4988635AJan 29, 1991

Method of manufacturing non-volatile semiconductor memory device

MITSUBISHI ELECTRIC CORP26 citations93
US4907198AMar 6, 1990

Semiconductor memory device

MITSUBISHI ELECTRIC CORP24 citations93
US5672533ASep 30, 1997

Field effect transistor having impurity regions of different depths and manufacturing method thereof

MITSUBISHI ELECTRIC CORP37 citations92
US5489791AFeb 6, 1996

Field effect transistor having impurity regions of different depths and manufacturing method thereof

MITSUBISHI ELECTRIC CORP22 citations92
US5229314AJul 20, 1993

Method of manufacturing field effect transistor having a multilayer interconnection layer therein with tapered sidewall insulation

MITSUBISHI ELECTRIC CORP33 citations92
US4866493ASep 12, 1989

Semiconductor memory device

MITSUBISHI ELECTRIC CORP25 citations92
US5231041AJul 27, 1993

Manufacturing method of an electrically programmable non-volatile memory device having the floating gate extending over the control gate

MITSUBISHI ELECTRIC CORP22 citations91
US5434439AJul 18, 1995

Dynamic random access memory having stacked type capacitor and manufacturing method therefor

MITSUBISHI ELECTRIC CORP18 citations82
US5276344AJan 4, 1994

Field effect transistor having impurity regions of different depths and manufacturing method thereof

MITSUBISHI ELECTRIC CORP17 citations82
US4989054AJan 29, 1991

Non-volatile semiconductor memory device using contact hole connection

MITSUBISHI ELECTRIC CORP19 citations82
US4746377AMay 24, 1988

Semiconductor device with thermally oxidized insulating and arsenic diffusion layers

MITSUBISHI ELECTRIC CORP18 citations82
US5949110ASep 7, 1999

DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof

MITSUBISHI ELECTRIC CORP6 citations74
US5892702AApr 6, 1999

Semiconductor memory device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP8 citations74
US5683929ANov 4, 1997

Method of manufacturing a semiconductor device having a capacitor

MITSUBISHI ELECTRIC CORP9 citations74
US5659191AAug 19, 1997

DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof

MITSUBISHI ELECTRIC CORP8 citations74
US5408114AApr 18, 1995

Semiconductor memory device having cylindrical capacitor and manufacturing method thereof

MITSUBISHI ELECTRIC CORP12 citations74
US5338699AAug 16, 1994

Method of making a semiconductor integrated device having gate sidewall structure

MITSUBISHI ELECTRIC CORP8 citations74
US5315140AMay 24, 1994

Semiconductor device having a polysilicon capacitor with large grain diameter

MITSUBISHI ELECTRIC CORP11 citations74
US5233212AAug 3, 1993

Semiconductor device having gate electrode spacing dependent upon gate side wall insulating dimension

MITSUBISHI ELECTRIC CORP9 citations74
US5100818AMar 31, 1992

Non-volatile semiconductor memory device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP12 citations74
US5093277AMar 3, 1992

Method of device isolation using polysilicon pad LOCOS method

MITSUBISHI ELECTRIC CORP10 citations74

RENESAS TECH CORP

5 patents

RENESAS ELECTRONICS CORP

1 patent

Showing the top 50 of 59 patents by PatentIndex Score.