Inventor
ARIMA HIDEAKI
JP59 patents
⚠️ This page may combine multiple inventors who share the name “ARIMA HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
44 patentsUS5049975ASep 17, 1991
Multi-layered interconnection structure for a semiconductor device
MITSUBISHI ELECTRIC CORP152 citations99
US5763921AJun 9, 1998
Semiconductor device including retrograde well structure with suppressed substrate bias effects
MITSUBISHI ELECTRIC CORP136 citations98
US6194758B1Feb 27, 2001
Semiconductor device comprising capacitor and method of fabricating the same
MITSUBISHI ELECTRIC CORP49 citations96
US5523596AJun 4, 1996
Semiconductor device having capacitor and manufacturing method therefor
MITSUBISHI ELECTRIC CORP53 citations96
US5486712AJan 23, 1996
DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof
MITSUBISHI ELECTRIC CORP36 citations96
US5378643AJan 3, 1995
Electrically programmable non-volatile semiconductor memory device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP50 citations96
US5162262ANov 10, 1992
Multi-layered interconnection structure for a semiconductor device and manufactured method thereof
MITSUBISHI ELECTRIC CORP57 citations96
US5051948ASep 24, 1991
Content addressable memory device
MITSUBISHI ELECTRIC CORP81 citations96
US5049516ASep 17, 1991
Method of manufacturing semiconductor memory device
MITSUBISHI ELECTRIC CORP69 citations96
US4465529AAug 14, 1984
Method of producing semiconductor device
MITSUBISHI ELECTRIC CORP81 citations96
US5101250AMar 31, 1992
Electrically programmable non-volatile memory device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP99 citations94
US6066881AMay 23, 2000
Integrated circuit having a memory cell transistor with a gate oxide layer which is thicker than the gate oxide layer of a peripheral circuit transistor
MITSUBISHI ELECTRIC CORP27 citations93
US5798289AAug 25, 1998
Method of manufacturing stacked capacitors in a DRAM with reduced isolation region between adjacent capacitors
MITSUBISHI ELECTRIC CORP20 citations93
US5612241AMar 18, 1997
Method of manufacturing a DRAM having peripheral circuitry in which source drain interconnection contact of a MOS transistor is made small by utilizing a pad layer
MITSUBISHI ELECTRIC CORP29 citations93
US5597755AJan 28, 1997
Method of manufacturing a stacked capacitor in a dram
MITSUBISHI ELECTRIC CORP25 citations93
US5480826AJan 2, 1996
Method of manufacturing semiconductor device having a capacitor
MITSUBISHI ELECTRIC CORP40 citations93
US5428239AJun 27, 1995
Semiconductor device having retrograde well and diffusion-type well
MITSUBISHI ELECTRIC CORP48 citations93
US5404042AApr 4, 1995
Semiconductor memory device having a plurality of well regions of different conductivities
MITSUBISHI ELECTRIC CORP26 citations93
US5381365AJan 10, 1995
Dynamic random access memory having stacked type capacitor and manufacturing method therefor
MITSUBISHI ELECTRIC CORP33 citations93
US5364811ANov 15, 1994
Method of manufacturing a semiconductor memory device with multiple device forming regions
MITSUBISHI ELECTRIC CORP26 citations93
US5218219AJun 8, 1993
Semiconductor memory device having a peripheral wall at the boundary region of a memory cell array region and a peripheral circuit region
MITSUBISHI ELECTRIC CORP35 citations93
US5194925AMar 16, 1993
Electrically programmable non-volatie semiconductor memory device
MITSUBISHI ELECTRIC CORP45 citations93
US5141891AAug 25, 1992
MIS-type semiconductor device of LDD structure and manufacturing method thereof
MITSUBISHI ELECTRIC CORP33 citations93
US4988635AJan 29, 1991
Method of manufacturing non-volatile semiconductor memory device
MITSUBISHI ELECTRIC CORP26 citations93
US4907198AMar 6, 1990
Semiconductor memory device
MITSUBISHI ELECTRIC CORP24 citations93
US5672533ASep 30, 1997
Field effect transistor having impurity regions of different depths and manufacturing method thereof
MITSUBISHI ELECTRIC CORP37 citations92
US5489791AFeb 6, 1996
Field effect transistor having impurity regions of different depths and manufacturing method thereof
MITSUBISHI ELECTRIC CORP22 citations92
US5229314AJul 20, 1993
Method of manufacturing field effect transistor having a multilayer interconnection layer therein with tapered sidewall insulation
MITSUBISHI ELECTRIC CORP33 citations92
US4866493ASep 12, 1989
Semiconductor memory device
MITSUBISHI ELECTRIC CORP25 citations92
US5231041AJul 27, 1993
Manufacturing method of an electrically programmable non-volatile memory device having the floating gate extending over the control gate
MITSUBISHI ELECTRIC CORP22 citations91
US5434439AJul 18, 1995
Dynamic random access memory having stacked type capacitor and manufacturing method therefor
MITSUBISHI ELECTRIC CORP18 citations82
US5276344AJan 4, 1994
Field effect transistor having impurity regions of different depths and manufacturing method thereof
MITSUBISHI ELECTRIC CORP17 citations82
US4989054AJan 29, 1991
Non-volatile semiconductor memory device using contact hole connection
MITSUBISHI ELECTRIC CORP19 citations82
US4746377AMay 24, 1988
Semiconductor device with thermally oxidized insulating and arsenic diffusion layers
MITSUBISHI ELECTRIC CORP18 citations82
US5949110ASep 7, 1999
DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof
MITSUBISHI ELECTRIC CORP6 citations74
US5892702AApr 6, 1999
Semiconductor memory device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP8 citations74
US5683929ANov 4, 1997
Method of manufacturing a semiconductor device having a capacitor
MITSUBISHI ELECTRIC CORP9 citations74
US5659191AAug 19, 1997
DRAM having peripheral circuitry in which source-drain interconnection contact of a MOS transistor is made small by utilizing a pad layer and manufacturing method thereof
MITSUBISHI ELECTRIC CORP8 citations74
US5408114AApr 18, 1995
Semiconductor memory device having cylindrical capacitor and manufacturing method thereof
MITSUBISHI ELECTRIC CORP12 citations74
US5338699AAug 16, 1994
Method of making a semiconductor integrated device having gate sidewall structure
MITSUBISHI ELECTRIC CORP8 citations74
US5315140AMay 24, 1994
Semiconductor device having a polysilicon capacitor with large grain diameter
MITSUBISHI ELECTRIC CORP11 citations74
US5233212AAug 3, 1993
Semiconductor device having gate electrode spacing dependent upon gate side wall insulating dimension
MITSUBISHI ELECTRIC CORP9 citations74
US5100818AMar 31, 1992
Non-volatile semiconductor memory device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP12 citations74
US5093277AMar 3, 1992
Method of device isolation using polysilicon pad LOCOS method
MITSUBISHI ELECTRIC CORP10 citations74
RENESAS TECH CORP
5 patentsUS7439132B2Oct 21, 2008
Semiconductor device comprising capacitor and method of fabricating the same
RENESAS TECH CORP12 citations93
US7368776B2May 6, 2008
Semiconductor device comprising a highly-reliable, constant capacitance capacitor
RENESAS TECH CORP10 citations93
US7045420B2May 16, 2006
Semiconductor device comprising capacitor and method of fabricating the same
RENESAS TECH CORP12 citations93
US6940116B2Sep 6, 2005
Semiconductor device comprising a highly-reliable, constant capacitance capacitor
RENESAS TECH CORP12 citations93
US7816204B2Oct 19, 2010
Semiconductor device comprising capacitor and method of fabricating the same
RENESAS TECH CORP4 citations74
RENESAS ELECTRONICS CORP
1 patentShowing the top 50 of 59 patents by PatentIndex Score.