Inventor
SINGH NAVNEET K
IN7 patents
Patents
7 patentsUS10177161B2Jan 8, 2019
Methods of forming package structures for enhanced memory capacity and structures formed thereby
INTEL CORP3 citations66
US12382575B2Aug 5, 2025
Solderless or groundless electromagnetic shielding in electronic devices
INTEL CORP0 citations53
US10720407B2Jul 21, 2020
Microelectronic interposer for a microelectronic package
INTEL CORP0 citations48
US10199353B2Feb 5, 2019
Microelectronic interposer for a microelectronic package
INTEL CORP0 citations48
US10734393B2Aug 4, 2020
Methods of forming package structures for enhanced memory capacity and structures formed thereby
INTEL CORP0 citations45
US10656177B2May 19, 2020
Probe connector for a probing pad structure around a thermal attach mounting hole
INTEL CORP0 citations45
US10317428B2Jun 11, 2019
Probe connector for a probing pad structure around a thermal attach mounting hole
INTEL CORP0 citations45