Inventor
KWON YIEOK
KR6 patents
Patents
6 patentsUS11569175B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US10930525B2Feb 23, 2021
Carrier substrate and method of manufacturing semiconductor package using the carrier substrate
SAMSUNG ELECTRONICS CO LTD2 citations65
US12119305B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11398420B2Jul 26, 2022
Semiconductor package having core member and redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12575418B2Mar 10, 2026
Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations49
US12525526B2Jan 13, 2026
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49