Inventor

WANG HSIN HSIANG

TW3 patents

Patents

3 patents

US11373956B2Jun 28, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations57

US11545427B2Jan 3, 2023

Capacitor bank structure and semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations47

US11201110B2Dec 14, 2021

Semiconductor device package with conductive pillars and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations47