Inventor
KANG HYEONGMUN
KR10 patents
Patents
10 patentsUS11257794B2Feb 22, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US12125753B2Oct 22, 2024
Semiconductor package including test bumps
SAMSUNG ELECTRONICS CO LTD0 citations61
US11257725B2Feb 22, 2022
Semiconductor package including test bumps
SAMSUNG ELECTRONICS CO LTD1 citations61
US11721601B2Aug 8, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US9035308B2May 19, 2015
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations60
US11658160B2May 23, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11469099B2Oct 11, 2022
Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages
SAMSUNG ELECTRONICS CO LTD0 citations58
US11756935B2Sep 12, 2023
Chip-stacked semiconductor package with increased package reliability
SAMSUNG ELECTRONICS CO LTD0 citations46
US12463105B2Nov 4, 2025
Semiconductor package including a dummy chip
SAMSUNG ELECTRONICS CO LTD0 citations42
US12230575B2Feb 18, 2025
Carrier structure including pockets for accommodating semiconductor chip stack structure
SAMSUNG ELECTRONICS CO LTD0 citations41