Inventor · disambiguated record
Bangweon Lee
Also filed as: LEE BANGWEON
6 granted patents·2 citations·filing 2020–2024
68Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0186US11380635B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 0269US12243803B2Thermal interface material, method of manufacturing the same, and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0362US11855013B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·16 claims
- 0461US12469764B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0558US11935812B2Thermal interface material and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0657US12494412B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →